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Laser Applications in Dialogue
8TH INTERNATIONAL LASER MARKETPLACE

Wednesday, June 20th 2007, 8:45 to 13:30
ICM—International Congress Centre Munich


The 8th International Laser Marketplace will be held in conjunction with the LASER 2007. World of Photonics trade fair. The seminar is focused on markets and new technologies in laser materials processing, and is addressed to professionals in marketing, R&D, and corporate decision making.

Program:

Global market for industrial lasers—
Will fiber lasers drive future growth?
   Fiber laser performance and economics— Status and trend for low power, high power, pulsed lasers
David Belforte
Belforte Associates, Sturbidge, MA, USA
Dr. Per Stenius
Liekki, Lohja, Finland


 

Recent advances in DPSS lasers and their use in fast growing application areas such as solar cell, FPD and micro processing Laser marking, engraving and cutting— A system integrator’s assessment of fiber lasers, solid state lasers, CO2 lasers
David Clark
Newport Spectra Physics, Mountain View, CA, USA
Dr. Andreas Penz
Trotec, Wels, Austria


Multi-kW diode lasers challenge solid state lasers in welding and cutting—New lasers push process speed and performance Micro processing, cutting, spot & seam welding—
Solid state and fiber lasers compete for best performance
Dr. Christoph Ullmann
Laserline, Mülheim-Kärlich, Germany
  Dr. Michael Schmidt
Bayerisches Laserzentrum, Erlangen, Germany



 

Laser systems market—Status and trend

Strong market growth for laser materials
processing in Japan
Demand for laser systems reaches record high —growth shifts to Asia, emerging markets
Dr. Kunihiko Washio
Paradigm Research, Machida, Japan
Dr. Arnold Mayer
Optech Consulting, Tägerwilen, Switzerland





The Laser Marketplace is organized by Optech Consulting and Messe München GmbH:
                                                                                

 

Participation and Registration:

Online registration

To register online please click here.

 

For any questions regarding the registration please contact:

INTERPLAN AG
Ms. Elvine Dengel
Tel: +49 (0)89 548 234 48
Fax: +49 (0)89 548 234 42
Email: lm07@interplan.de

pdf25px Download registration form (62 KB)



Registration fee: EUR 395 plus 19% VAT.
Early registration fee (until May 15th 2007): EUR 350 plus 19% VAT

Registration deadline: June 8th 2007
Registration includes admission ticket to trade fair.
Conference language is English.



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