| Manufacturer of substrates, windows, wafers and other flat optics. Precision machining services: Lapping, polishing, dicing, grinding. Materials: Fused Silica, Quartz, Glass, Ceramics, Sapphire, Silicon. Ultra-thin (<25nm) ultra-flat (1/10 wave), superpolishing (<10/5 scratch/dig), tight tolerances (+1 nm). |
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